2025年5月8日，全球第七届半导体产业与电子技术（重庆）博览会在重庆国际博览中心盛大启幕。作为中国顶尖的快样及批量电路板生产商，深圳市金晟达电子技术有限公司携核心技术与创新成果首次亮相这一行业盛会，以“精准交付、高效赋能”为主题，向全球客户展示其在通信、汽车电子、航空航天等领域的硬核实力。

On May 8, 2025, the 7th Global Semiconductor Industry and Electronic Technology Expo (Chongqing) grandly opened at the Chongqing International Expo Center. As a leading manufacturer of fast sample and batch circuit boards in China, Shenzhen Jinshengda Electronic Technology Co., Ltd. made its debut at this industry event with its core technologies and innovative achievements. With the theme of "Precise Delivery and Efficient Empowerment", it showcased its solid strength in the fields of communication, automotive electronics, aerospace, etc. to global customers.

首日聚焦：技术突破与行业标杆的碰撞

The first day's focus: The collision of technological breakthroughs and industry benchmarks

展会首日，金晟达电路的展位（展位号：A108）便成为焦点。公司重点展示了其多层板快速样单加工能力——一个工作日可完成180余款样单，其中60%为高精度多层板，月产量突破5000平方米。这一技术实力已获得华为、中兴等头部企业的“优秀供应商”认证，并成功应用于军工、医疗器械等对可靠性要求严苛的领域。

On the first day of the exhibition, the booth of Jinshengda Circuit (Booth No. : A108) immediately became the focus. The company highlighted its rapid sample processing capability for multi-layer boards - it can complete over 180 sample orders within one working day, among which 60% are high-precision multi-layer boards, with a monthly output exceeding 5,000 square meters. This technological strength has been certified as an "Outstanding Supplier" by leading enterprises such as Huawei and ZTE, and has been successfully applied in fields with strict reliability requirements, such as military industry and medical devices.

现场工作人员透露，金晟达电路的“准时交付”服务是其核心竞争力之一。通过智能化生产线与精益化管理，公司实现了从设计到量产的全流程高效协同，尤其针对中小批量订单的快速响应能力，成为众多客户选择其合作的关键因素。

On-site staff disclosed that the "on-time delivery" service of Jinshengda Circuit is one of its core competencies. Through intelligent production lines and lean management, the company has achieved efficient collaboration throughout the entire process from design to mass production. Particularly, its rapid response capability for small and medium-sized batch orders has become a key factor for many customers to choose to cooperate with it.

战略签约：与全球伙伴共拓西部市场

Strategic Signing: Jointly expanding the Western market with Global Partners

展会首日，金晟达电路与多家国际知名企业达成战略合作意向，涵盖半导体封装测试、智能网联汽车电子等前沿领域。公司负责人表示：“重庆作为中西部电子信息产业高地，其‘芯屏器核网’全产业链布局与金晟达的技术方向高度契合。我们期待通过此次展会，深化与川渝地区产业链伙伴的合作，共同推动西部半导体产业升级。”

On the first day of the exhibition, Jinshengda Circuit reached strategic cooperation intentions with several well-known international enterprises, covering cutting-edge fields such as semiconductor packaging and testing, and intelligent connected vehicle electronics. The person in charge of the company stated: "As a highland of the electronic information industry in the central and western regions, Chongqing's full industrial chain layout of 'chips, screens, devices, cores and networks' is highly consistent with the technical direction of Jinshengda." We look forward to deepening cooperation with industrial chain partners in Sichuan and Chongqing through this exhibition and jointly promoting the upgrading of the semiconductor industry in the western region.

技术论坛：分享高精度PCB生产经验

Technical Forum: Sharing experience in high-precision PCB production

同期举办的“先进封装测试创新发展论坛”上，金晟达电路工程团队受邀发表主题演讲，分享其在高密度互连（HDI）板、高频高速材料应用等领域的创新实践。演讲中，团队强调了“工艺稳定性”与“客户定制化需求”的平衡之道，并透露公司正投入研发新一代5G通信专用PCB技术，以满足未来通信设备对信号完整性的更高要求。

At the concurrent "Advanced Packaging and Testing Innovation and Development Forum", the circuit engineering team of Jinshengda was invited to deliver a keynote speech, sharing its innovative practices in areas such as high-density interconnect (HDI) boards and high-frequency high-speed material applications. During the speech, the team emphasized the balance between "process stability" and "customized customer demands", and disclosed that the company is investing in the research and development of a new generation of 5G communication-specific PCB technology to meet the higher requirements for signal integrity in future communication equipment.

未来展望：以“芯”技术赋能产业生态

Future Outlook: Empowering the industrial ecosystem with "core" technology

随着展会的持续推进，金晟达电路将于明日（5月9日）在展位现场邀请行业专家、客户代表共同探讨PCB技术发展趋势。公司表示，未来将持续加大在智能制造、绿色生产等领域的投入，助力全球电子产业链向更高效、更环保的方向迈进。

As the exhibition progresses, Jinshengda Circuit will invite industry experts and customer representatives to discuss the development trends of PCB technology at its booth tomorrow (May 9th). The company stated that in the future, it will continue to increase investment in areas such as intelligent manufacturing and green production, and help the global electronic industry chain move towards a more efficient and environmentally friendly direction.

展会信息  Exhibition Information

• 时间  Time
  ：2025年5月8日-10日  May 8th - 10th, 2025
• 地点  Location

  ：重庆国际博览中心（渝北区悦来大道66号）

   

  Chongqing International Expo Center (No. 66, Yuelai Avenue, Yubei District)
• 金晟达电路展位  JSDPCB Circuit Booth
  ：A208

展会首日，金晟达电路以技术实力与战略眼光，为全球半导体产业注入新动能。未来两天，更多精彩，敬请期待！

On the first day of the exhibition, Jinshengda Circuit, with its technological strength and strategic vision, injected new impetus into the global semiconductor industry. More exciting content awaits in the next two days. Stay tuned!