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共赴航天盛会，共探遥感通信新未来

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2025-06-17 11:07

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2025年6月12日，金晟达将亮相第四届遥感·通信创新大会，与行业精英共话卫星技术前沿。作为微波通信领域的创新力量，金晟达将携高可靠性卫星通信电路解决方案及“放心板”制造理念，深度参与卫星批产设计、星座运营等议题研讨，并展示在雷达、相控阵天线等领域的核心产品。大会聚焦“创新发展 合作共赢”，金晟达期待与长光卫星、鑫云科技等企业共拓商业航天协同新模式，携手推动航天技术成果转化，赋能产业高质量发展。

On June 12, 2025, JSDPCB will make its appearance at the 4th Remote Sensing & Communication Innovation Conference, where it will discuss the cutting-edge of satellite technology with industry elites. As an innovative force in the field of microwave communication, Jinshengda will bring high-reliability satellite communication circuit solutions and the manufacturing concept of "reassuring boards", deeply participate in discussions on issues such as satellite batch production design and constellation operation, and showcase its core products in areas such as radar and phased array antennas. The conference focuses on "Innovative development and win-win cooperation". JSDPCB looks forward to jointly exploring new models of commercial aerospace collaboration with enterprises such as Changguang Satellite and Xinyun Technology, working together to promote the transformation of aerospace technology achievements and empower the high-quality development of the industry.
时间：2025年6月12日
Time：June 12, 2025
地点：长春国际会展中心
Location:Changchun International Convention and Exhibition Center

金晟达展位：A22    诚邀莅临，共启航天新篇章！

JSDPCB booth：A22  sincerely invites you to visit and embark on a new chapter of navigation together!

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